Introduction:
Thermal evaporation is a common method of physical vapor deposition (PVD). It is one of the simplest forms of PVD and typically uses a resistive heat source to evaporate a solid material in a vacuum environment to form a thin film. The material is heated in a high vacuum chamber until vapor pressure is produced. The evaporated material traverses the vacuum chamber with thermal energy and coats the substrate.
Specifications:
- Substrate size: Up to 4”
- Substrate rotation: 0 – 20 rpm
- Vacuum: Achieve 10-6 Torr
- Source: 2 evaporation sources
- Thickness control: Inficon deposition controller
- Substrate type: Wafer, plastic, glass
Notes to user:
User should weight the materials (Au, Pd, Pt) before and after deposition and write down on the log book, otherwise the materials cost will be charged by estimation.
Supplier information:
Please click here to download the equipment introduction poster.
Equipment location:
Room HJ705 (Class 1,000)
