Introduction:
Magnetron Sputtering is a physical vapor deposition that commonly use to deposit the metal and semiconductor materials. Sputtering can usually produce high-quality film with an uniform thickness over few inch of areas. These deposition involved Argon ions under influence of electric field bombarded the target surfaces and ejected atoms travelled towards the substrate.
Specifications / Applications:
- High Vacuum chamber (base pressure: 10-5 Torr)
- 2 inch sputter sources (normal incidence) x 3 (allowed sputtering of metallic and dielectric materials)
- DC sputter power source (Advanced Energy Maximum power : 1kW)
- RF sputter power source (Advanced Energy Maximum power : 0.6kW)
- Substrate holder (3 inch)
- Substrate temperature (up to 300oC)
- Manual control
- Target materials available: Aluminum, Chromium, Copper, Gold, Silver, Titanium
Notes to user:
N/A
Equipment location:
Room BC718
