Imaging Bond Tester for Non-destructive Evaluation
Location: W103a
Process: Material Testing
*please make a consultation e-booking to brief us on your requirements
Specification
- Suited for Honeycomb sandwiched composites, GLARE and dissimilar metal structures
- Employ Pitch-catch and MIA methods: 250-1.5MHz
- Provide C-scan for bond testing
- Real-time data logging and report function
- Max. Part size: 460 x 460mm
