Physical Vapour Deposition (PVD)
Location: W401
Process: Physical Vapour Deposition (PVD)
Material: Polymer, glass, metals, ceramic
Specification
- Arc or magnetron sputtering coating process
- Operation temperature up to 400oC
- Target source: Arc x 1, magnetron sputtering x 2, all are diameter 150mm
- Vacuum: Achieve ≤1x10-4 mbar (7.5x10-5Torr)
- Target available: ITO, C, Cu, Al, Zr, Cr, Ti, TiAl, TiAlCr, SS 316 or user’s target
- Reactive gas available: Nitrogen, Oxygen, Acetylene
- Applicable substrate: Polymer, glass, metals, ceramic, etc
