Introduction:
E-beam (electron beam) evaporation is a thermal evaporation process, which is one of the most common types of physical vapor deposition (PVD). E-beam evaporation provides for the direct transfer of a larger amount of energy into the source material, enabling the evaporation of metal and dielectric materials with very high melting temperatures. Therefore, it is possible to deposit materials that cannot be evaporated with standard resistive thermal evaporation. An additional benefit of e-beam evaporation is higher deposition rates than possible with either sputtering or resistive evaporation.
In e-beam evaporation, the evaporation material can be placed into a crucible and heated by a focused electron beam. The heat from the electron beam vaporizes the material, which then deposits on the substrate to form the required thin film.
Specifications:
- Substrate size: Up to 4”
- Substrate rotation: 0 – 20 rpm
- Vacuum: Achieve to 10-7 Torr
- Thickness control: Inficon deposition controller
- Heater: Quartz lamp heater, max. 200°C
- Source: 4 pocket x 7cc capacity
- Controller: 4-channel sweep controller
Notes to user:
User should weight the materials (Au, Pd, Pt) before and after deposition and write down on the log book, otherwise the materials cost will be charged by estimation.
Supplier information:
https://www.dentonvacuum.com/products-technologies/e-beam-evaporation/explorer/
Please click here to download the equipment introduction poster.
Equipment location:
Room HJ705 (Class 1,000)
