Introduction:
HMDS vapor priming has been used for improving resist wetting and adhesion to substrates. Our hotplate can process dehydration and priming of wafer with HMDS with temperature control.
Specifications:
- Coating: For HMDS coating
- Max. substrate size: 200mm
- Temperature: 25 - 250°C
- Accuracy: ± 0.5°C per 100°C
Notes to user:
Supplier information:
Equipment location:
Room HJ705 (Class 100)