Dicing Saw (DISCO DAD3220)

Introduction:

DISCO DAD3220 is a high performance automatic dicing saw for processing electronic component materials such as glasses and ceramics. microscope and lens with the visible range to full of the work piece surface.

Specifications / Applications:

• Spindle output: 1.5 kW
• Torque: 0.48 Nsm
• Wafer size up to 6" diameter or square
• Z-axis moving resolution: 0.05 µm

Notes to user:

User shall bring your own cutting blade, suggested model: NBC-Z 2050 “55 x 0.03 x 40” or “55 x 0.007 x 40”

Supplier information:

         https://www.disco.co.jp/eg/products/catalog/pdf/dad3220.pdf

Please click here to download the equipment introduction poster.

Equipment location:

Room BC708a