Introduction:
DISCO DAD3220 is a high performance automatic dicing saw for processing electronic component materials such as glasses and ceramics. microscope and lens with the visible range to full of the work piece surface.
Specifications / Applications:
- Spindle output: 1.5 kW
- Torque: 0.48 Nsm
- Wafer size up to 6" diameter or square
- Z-axis moving resolution: 0.05 µm
Notes to user:
User shall bring your own cutting blade, suggested model: NBC-Z 2050 “55 x 0.03 x 40” or “55 x 0.007 x 40”
Supplier information:
https://www.disco.co.jp/eg/products/catalog/pdf/dad3220.pdf
Please click here to download the equipment introduction poster.
Equipment location:
Room BC708a
