PAIR Seed Fund Project Name:
Integrated Ferroelectronics for Non-volatile In-memory Computing
Objectives:
The emerging paradigm of “abundant-data” computing requires real-time analytics on enormous quantities of data collected by a mushrooming network of sensors feeding into “the cloud”. However, today’s computing technology cannot satisfy such abundant-data applications with the required throughput and energy efficiency. The performance gap between the processor and the memory has been growing, which has become the key limiting factor for computing performance and energy efficiency improvements.
To overcome the memory–logic interconnect bottleneck, the team developed emerging microelectronic devices for the in-memory computing (IMC) with diffused boundaries between memory and logic to deliver increased performance gains exceeding that historically provided by downscaling.
Key Research Outcomes:
- Published two papers based on the research results
- Secured fundings from external funding schemes including: Ministry of Science and Technology (MOST) National Key Research and Development Program, The National Natural Science Foundation of China (NSFC)/Research Grants Council (RGC) of Hong Kong Joint Research Scheme (JRS)
- Research work recognised as one of the Top Ten Innovation and Technology News in Hong Kong 2022
- Established a Joint Research Center for Microelectronics with Peking University
- Further developed proposals for submission to external funding schemes including: Research Impact Fund (RIF), Strategic Topics Grant (STG)
