Once the exchange arrangements with the assigned host institutes are confirmed, students can apply for financial assistance via the Faculty Office.

• Two types of financial assistance, namely the exchange sponsorship and hardship fund, are available.
• Undergraduate students can apply for the following financial assistance during their entire courses of studies:
  • One-time Faculty sponsorship and/or hardship fund for the participation in an overseas exchange activity.
  • One-time Faculty sponsorship and/or hardship fund for the participation in a Chinese Mainland/Taiwan exchange activity.
• The Faculty will provide sponsorship and/or hardship fund to the applicants according to the rankings of their exchange applications as evaluated and recorded on our system, and subject to budget availability.
• The sponsorship and hardship funds to be provided are determined by the exchange destinations.

 

2024/25 Faculty Sponsorship and Hardship Fund

Destinations	Faculty Sponsorship	Hardship Fund
Americas	HK$22,000	An additional percentage of the Faculty sponsorship This additional percentage is the highest percentage of the grant, loan or subsidy against the given maximum amount granted by a recognized scheme.
Asia (except Japan & Korea)	HK$8,000
Japan	HK$22,000
Korea	HK$12,000
Europe (except UK)	HK$15,000
UK	HK$22,000
Nordic countries	HK$20,000
Oceania	HK$22,000
Chinese mainland	HK$8,000
Taiwan	HK$8,000

• Recognized schemes include the financial assistance schemes provided by the Government of the HKSAR for full-time undergraduate students attending publicly-funded programmes and all those provided to undergraduate students by the University. Hardship fund can also be provided on a case-by-case basis.
• Students who have applied for other subsidies/grants for their exchange in 2024/25 are welcome to apply for the Faculty sponsorship and/or Hardship Fund.
• The levels of Faculty sponsorship and hardship funds will be reviewed annually.
• The maximum financial assistance provided by FB per application can be found here.