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The 19th International Congress on Logistics and SCM Systems on AI-empowered logistics and supply chain

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  • Date

    07 - 09 Jul 2025

  • Organiser

    Department of Industrial & Systems Engineering (ISE) and the Research Institute of Advanced Manufacturing (RIAM) of The Hong Kong Polytechnic University

  • Time

    08:00 - 18:00

  • Venue

    The Hong Kong Polytechnic University  

Summary

The 19th International Congress on Logistics and SCM Systems on AI-empowered logistics and supply chain will be held on 7-9 July 2025 in Hong Kong, China. The conference is hosted by the Department of Industrial & Systems Engineering (ISE) and the Research Institute of Advanced Manufacturing (RIAM) of The Hong Kong Polytechnic University. It will feature plenary speeches, panel sessions, tutorials, workshops, interactive sessions, and invited/special sessions. Contributions are expected from academia, industry, and management agencies. This conference aims to attract worldwide attention from academia and talent in the logistics and supply chain industry to facilitate the exchange of ideas and collaborative work across various disciplines, thereby ensuring the smooth and sustainable operation of the global supply chain.

 

Call for Papers:

Authors should adhere to the following steps for submitting papers:

  1. Create an account: https://cmt3.research.microsoft.com/.
  2. Download a template: [LaTex template] or [Microsoft Word template]. Use these templates/style files to create a paper and save in PDF format.
  3. Upload the paper: https://cmt3.research.microsoft.com/ , click on "All Conferences" to search the "ICLS2025", then click on the Conference Name link. Click "Create New Submission" to submit a regular paper, a special session paper, or a presentation only paper at "SUBJECT AREAS".

 

Call for Special Sessions:

To submit your special session proposal for consideration, please follow these steps:

  1. Download and prepare the special session proposal template.
  2. Send the special session proposal to icls2025@polyu.edu.hk .

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