Hot Solutions

Hot Solutions is developing a heat dissipating interposer substrate technology to help 3D electronics manufacturers reduce product heat buildup using a 3D additive ceramic manufacturing process.

3D Integrated Circuit (3DIC) is one of the most significant new technologies, yet heat reduction is still limiting its application. Hot Solutions is looking into a novel interposer fabrication technology 50 times better in heat dissipation than current organic material, which can alleviate the thermal management problem by 3D Printing. The versatile digital manufacturing method realises Industry 4.0 for smart manufacturing of electronic components, and enables faster product turnarounds with minimal waste materials, simplified production and efficient production even with low volumes.