特邀演講者（只有英文版本）

3D curvy electronics based on conformal additive stamp (CAS) printing

Abstract

Electronic devices are typically manufactured in planar layouts; yet many emerging devices, ranging from optoelectronics to wearables, require three-dimensional curvy form factors. The fabrication of such structures has though proved challenging, in particular, due to the lack of an effective manufacturing technology. In this talk, I would like to present our recent development of a conformal additive stamp (CAS) printing technology for reliably manufacturing of 3D curvy electronics. CAS printing employs a pneumatically inflated elastomeric balloon as a conformal stamping medium to pick up pre-fabricated electronic devices and print them onto random shaped curvy surfaces. Due to the excellent deformability, the balloon stamp is able to contact and pick up the pre-fabricated devices and then bring into conformable contact with the targeted 3D curvilinear surfaces to complete the delivery. To illustrate the capabilities of our CAS printing, I will present various devices with curvy shapes: silicon pellets, photodetector arrays, curvy imagers, smart contact lenses, etc.