Magnetron Sputtering System B

Introduction:

Magnetron Sputtering is a physical vapor deposition that commonly use to deposit the metal and semiconductor materials.  Sputtering can usually produce high-quality film with a uniform thickness over few inch of areas. These deposition involved argon ions under influence of electric field bombarded the target surfaces and ejected atoms travelled towards the substrate.

Specifications / Applications:

• High-vacuum chamber (base pressure: 10^-5 Torr)
• 2 inch sputter sources (normal incidence) x 3 (allowed co-sputtering of metallic materials only)
• DC sputtering power source (Advanced Energy Maximum power : 1kW)
• Substrate holder (3 inch)
• Substrate temperature (room temperature only)
• Manual control
• Target materials available: Aluminum, Chromium, Copper, Gold, Silver, Titanium

Notes to user:

N/A

Equipment location:

Room BC718