Introduction:
UV mask aligner is equipment used in microfabrication to pattern parts of a thin film or the bulk of a substrate. It uses light to transfer a geometric pattern from a photomask to a light-sensitive chemical "photoresist", or simply "resist," on the substrate. A series of chemical treatments then either engraves the exposure pattern into, or enables deposition of a new material in the desired pattern upon, the material underneath the photoresist.
Specifications:
- Light source: 350W UV light
- Resolution: <0.8µm max.
- Alignment: Top side alignment
- Alignment accuracy: <± 0.5µm
- Substrate: Up to 4” round wafer
Notes to user:
Supplier information:
Please click here to download the equipment introduction poster.
Equipment location:
Room HJ705 (Class 100)