Congratulations to Winnie CHU Wing Wai, an undergraduate student at the Department of Land Surveying and Geo-Informatics (LSGI), for receiving the ‘HSBC Hong Kong Scholarship' for the 2023/24 academic year. This prestigious scholarship, awarded by The Hongkong and Shanghai Banking Corporation Limited (HSBC), aims to recognise the full-time undergraduate students who have a strong commitment to Hong Kong and are active in community service.
Winnie was selected as the awardee by the HSBC Scholarship Selection Committee, and will receive a scholarship of HKD 50,000. The award ceremony, called the “HSBC Scholars Day”, was held at the HSBC Main Building on 10 July 2024, where Winnie was recognized for her outstanding academic achievements and valuable contributions to the community.
The HSBC scholarship scheme has been nurturing future leaders with diverse academic or socioeconomic backgrounds since 1965. As of 2023, HSBC has granted over HKD262 million in scholarships to support high-achieving Hong Kong students, with the aim of continuing to enrich the young talent pool and provide opportunities for growth through various flagship scholarship programmes.
Once again, we congratulate Winnie on her remarkable achievement and wish her success in all her future endeavors!